YCS Mr.Yang M.Y X-17 CPU Reballing Kit for iPhone X to 17 Pro Max Motherboard Repair

The YCS Mr.Yang M.Y X-17 CPU Reballing Kit is a professional BGA reballing solution designed for iPhone motherboard CPU repair and chip replacement work. It includes precision positioning molds and reballing stencils for accurate solder ball placement on iPhone X to iPhone 17 Pro Max series devices. Ideal for advanced microsoldering technicians performing CPU reballing, board repair, and IC replacement.