Rabbitfix UniBall Mid-Layer Solder Balls 183°C (100,000 Balls/Bottle)

This is a bottle of mid-layer solder balls designed for smartphone repairs, specifically for reballing and BGA (Ball Grid Array) work on both Android and iPhone devices. Each bottle contains 100,000 solder balls with a melting point of 183°C. The product comes in two variants tailored for Android or iPhone models. It is ideal for professional mobile phone technicians performing chip-level repairs and rework.