MIJING Z23 Samsung S20 Ultra Middle-Layer BGA Reballing Platform

Precision magnetic positioning platform designed specifically for Samsung Galaxy S20 Ultra middle-layer motherboard repair. It uses a 0.12 mm precision BGA stencil and magnetic positioning system for accurate solder-ball placement during mid-layer reballing and board-level repair. The Z23 platform is also compatible with other Samsung S-series models depending on the positioning module.