MIJING Z23 Samsung Galaxy S21+ Middle Layer BGA Reballing

A Mijing Z23 reballing platform cut for the Samsung Galaxy S21 Plus middle layer — the interposer array that joins the stacked halves of the logic board.

• Cut specifically for the Samsung Galaxy S21 Plus middle-layer footprint
• Holds the board flat so the stencil sits square
• Steel construction that stays flat under hot air

Compatible with: Samsung Galaxy S21 Plus logic board.