Mijing Z21 Max CPU Universal BGA Reballing Stencil Platform Kit

This is a professional, high-precision magnetic tin-planting and chip-reballing fixture engineered for micro-soldering technicians. The Z21 Max series relies on an upgraded dynamic magnetic original positioning core that automatically snaps and clamps micro-chips flat against incoming stencils. It features a complete universal array of laser-cut, square-holed steel meshes to handle Apple CPU architectures from A8 up to A18 Pro / A19 series (iPhone X through 16/17 Series) alongside major Android chip formats including Qualcomm Snapdragon, HiSilicon Kirin, and MediaTek (MTK).