Mijing iRepair MS1 Layered Module-G (iPhone 16 Series Configuration).

This is a professional, high-precision desoldering expansion plate custom-engineered for modern micro-soldering technicians. Designated as Module-G, it locks directly onto the main Mijing iRepair MS1 intelligent base preheater station using synthetic corner-latching tabs.
It features dual-molded side structures tailored perfectly to fit the staggered board contours of the iPhone 16, 16 Plus, 16 Pro, and 16 Pro Max. Technicians utilize this module to deliver perfectly balanced, uniform thermal distribution across double-layered logic boards, enabling safe layer separation, BGA chip desoldering, and structural frame cleaning without causing hot-spot warp damage.