Huawei Kirin 970 CPU Positioning BGA Reballing Stencil (HW-1)
★★★★★No reviews
Rs. 1,000
In stock
A precision reballing stencil designed for Huawei (HW) series motherboard repair. It ensures accurate IC alignment and even solder paste application, helping technicians achieve clean and reliable soldering results during chip-level rework and maintenance tasks.