Mijing HC-03 / HC-05 / HC-08 High Quality Solder Wire (50g, 183°C)

This is a professional-grade, high-purity rosin core welding consumable designed specifically for precision micro-soldering, mobile phone motherboard BGA repair, and micro-component jumper wire work under a microscope. It features a low-melting point of 183°C with a standard composition mix of 60% Tin (Sn) and 40% Lead/Leaded contents. The wire offers low electrical resistance, excellent thermal conductivity, strong oxidation resistance, and leaves minimal active clear residue behind, which prevents PCB board corrosion. It is available in three micro-diameters depending on the repair task: 0.3mm (HC-03), 0.5mm (HC-05), and 0.8mm (HC-08).