LB WiFi Welding Board BGA 196 14x14mm for Mobile Phone IC Reballing & Repair

The LB WiFi Welding Board BGA 196 14x14mm is a precision repair tool designed for mobile phone motherboard repair, IC reballing, and BGA soldering work. It helps technicians accurately align and weld WiFi IC chips during microsoldering repairs, ensuring better positioning and reliable results. Ideal for professional mobile repair shops and advanced electronics technicians.